Canteliver Probe Card
MPI Cantilever Probe Card is commonly applied on gold bump and pad wafer screening for Display screen driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response into the demands of fine pitch, tiny pad dimensions, superior speed, a lot less cleansing, multi-DUT, high pin count, and ultra-lower leakage necessities. With outstanding craftsmanship, modern architecture and proven methodologies depending on mechanical and electrical simulation/measurement benefits, building MPI the highest cantilever company all over the world.
FCB Probe Card
The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-sector (TTM) and price of exam (COT) desire. FCB is often a demonstrated Option for various semiconductor generation exams from early engineering pilot-runs to superior quantity production (HVM). FCB is ready for machine necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB ensures the entire world’s best In general Value-of-ownership (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is definitely an improvement about the conventional buckling beam probe card. Vital characteristics are greater present-day carrying capability (C.C.C.) and lower balanced contact power (BCF), as well as Total MEMS-like traits. EVS can certainly meet the prerequisite of Sophisticated wafer probing. Specific alignment and superb planarity Regulate will be the vital elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a great option for Highly developed probe cards.
Osprey probe card
The Osprey probe card is MPI’s Remedy to desire for at any time finer pitch. It is made for scaled-down Al pad, and is ideal for small pitch application with peripheral and whole array sample. With precise alignment and much better planarity Management, Osprey can arrive at higher productivity by multi-DUT layout. The forming wire (FW) form needle manufactured with MPI’s own micro fabrication method not merely delivers substantial-high-quality performance but also enables straightforward needle substitute and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card Osprey probe card is supplied with MEMS wire (MW) needle and that is created for the desire of very low pressure probing. What's more, it includes the opportunity to satisfy higher C.C.C. and higher pin counts application. The MEMS method guarantees extremely consistent needle characteristics, as well as Distinctive framework design and style enables specific alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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